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0630 Moulding SMD High Current Integrated Inductor for Switch & Servers

0630 Moulding smd power inductors
Introduction
• High rated current

• 125℃ maximum total temperature operation

• 7.3×6.8×3.0mm maximum surface mount package

• Low core loss

• Ultra low buzz noise due to molding construction
Availability:
Quantity:
  • YT0630

  • 850450

0630 Moulding smd power inductors

Introduction

• High rated current

• 125℃ maximum total temperature operation

• 7.3×6.8×3.0mm maximum surface mount package

• Low core loss

• Ultra low buzz noise due to molding construction

YT0630 mould smd inductor 1

Applications

• Laptops and PCs

• Switch and servers

• Base stations

• DC/DC converters

• Battery powered devices

• SSD modules

Product Identification

YT     0630   --6R8   M

①       ②          ③     ④


①  YT ---------- Series  name

② 0630 ---------- Dimension

③ 6R8 ----------- Inductance Value (6R8 = 6.8μH)

④  M -----------Inductance Tolerance ( M= ± 20% )


Dimensions   (unit:mm)

YT0630 mould smd inductor 2YT0630 mould smd inductor 3

A

B

C

D

E

a typ

b typ

c typ

7.0±0.3

6.6±0.2

2.8±0.2

1.6±0.3

3.0±0.3

3.7

8.4

3.5

Web:http://www.czystech.com E-mail :lydia@czystech.com whatsapp&Mob:18262965046


Marking


The inductor is marked with a 3-digit code

Nominal  Inductance

Example

Nominal Value

1R0

1.0 μH

100

10 μH

101

100 μH

Note:Using Ink for marking

YT0630 mould smd inductor 4

Structure and Components

Symbol

Components

Material

a

MARKING

Ink (black)

b

CORE

Alloy Sponge Powder

c

WIRE

Polyurethane copper wire

d

Terminal

Copper plated with Sn

YT0630 mould smd inductor 5

Web:http://www.czystech.com E-mail :lydia@czystech.com whatsapp&Mob:18262965046


Part No.

Inductance

DC Resistance

Saturation Current

Heating Rating Current

L0 (μH)

DCR (mΩ)

Isat (A)

Irms (A)

±20 %, 100 kHz, 1V

MAX.

TYP.

TYP.

0630-R22M

0.22

3

34

24

0630-R33M

0.33

3.5

25

21

0630-R47M

0.47

4.1

20

18

0630-R56M

0.56

4.5

18

16.5

0630-R68M

0.68

5.3

17

16

0630-R82M

0.82

6.0

16

14

0630-1R0M

1.0

7.4

15

12

0630-1R5M

1.5

12.1

12

12

0630-2R2M

2.2

15

10

9.5

0630-3R3M

3.3

22

9.5

8.5

0630-4R7M

4.7

33

9

6

0630-5R6M

5.6

42

6.5

5.5

0630-6R8M

6.8

48

6

5

0630-8R2M

8.2

60

5.5

5

0630-100M

10

68

5.5

4.5

0630-150M

15

113

4.0

3

0630-220M

22

170

3

2.5

0630-330M

33

270

2.5

2

0630-470M

47

385

2

1.5


Notes

1.  All test data is referenced to 25 °C ambient

2.  Operating temperature range - 55 °C to + 125 °C

3.  Irms (A):DC current (A) that will cause an approximate ΔT of 40 °C(reference ambient temperature is 25 °C)

4.  Isat(A):DC current (A) that will cause L0 to drop approximately 30 %

5.  The part temperature (ambient + temp rise) should not exceed 125 °C under worst case operating conditions.

    Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.



Web:http://www.czystech.com E-mail :lydia@czystech.com whatsapp&Mob:18262965046



Mechanical Reliability

Item

Specification and Requirement

Test Method

Solderability

1. No case deformation

or change in apperarance


2. New solder coverage

More than 95%

1.Preheat:155℃±5℃ ,60S±2S

2.Tin: lead-free.

3.Temperature:240℃±5℃,flux 3.0S±0.5S.


Mechanical

shock

1. No case deformation

or change in apperarance


2. △L/Lo≦±10%

1. Acceleration: 100G

2. Pulse time::6ms

3. 3 times in each positive and negative direction of 3 mutual perpendicular directions

Mechanical vibration

1. No case deformation

or change in apperarance


2. △L/Lo≦±10%

1. Reflow: 2times

2. Frequency: 10HZ~55HZ~10HZ,20 Min/Cycles

3. Amplitude: 1.52 mm

4. Directions: X,Y,Z

5. Time: 12 cycle / direction

Endurance Reliability

Item

Specification and Requirement

Test Method

Thermal Shock

Inductance change:

Within ± 10% Without distinct damage in appearance


1. First -55℃ for 30 minutes,last 125℃ for 30 minutes as 1 cycle. Go through  1000 cycles.

2. Max transfer time is 3 minutes.

3. Measured at room temperature after placing for 24±2 hours

Humidity

Resistance

Inductance change:

Within ± 10% Without distinct damage in appearance


1.Reflow 2 times,

2.85℃,85%RH,1000 hours

3.Measured at room temperature after placing for 24±2 hours

Low temperature

storage

Inductance change:

Within ± 10% Without distinct damage in appearance


1. Temperature:-55 ± 2℃

2. Time:1000 hours

3. Measured at room temperature after placing for 24±2 hours

High temperature

storage


Inductance change:

Within ± 10% Without distinct damage in appearance


1. Temperature:+125 ± 2℃

2. Time:1000 hours

3. Measured at room temperature after placing for 24±2 hours

Recommended Soldering Technologies

YT0630 mould smd inductor 6

(1)Re-flowing Profile


Preheat condition: 150 ~200℃/60~180sec.


Allowed time above 217℃: 80~120sec.


Max temp: 260℃


Max time at max temp: 10 sec.


Solder paste: Sn/3.0Ag/0.5Cu


Allowed Reflow time: 2x max

YT0630 mould smd inductor 7


(2)Iron Soldering Profile

Iron soldering power: Max. 30W


Pre-heating: 150℃/60sec.


Soldering Tip temperature: 350℃ Max.


Soldering time: 3sec. Max.

Solder paste: Sn/3.0Ag/0.5Cu


Max.1 times for iron solder


Packaging Information

(1) Tape Packaging DimensionsUnit:mm

YT0630 mould smd inductor 8YT0630 mould smd inductor 9


Type

Tape dimensions (mm)

W

P

P0

P2

D0

D1

T

A0

B0

K0

E

F

YT0630

16

±0.3

12

±0.1

4

±0.1

2

±0.1

1.5

±0.1

1.5

±0.1

0.35

±0.05

6.9

±0.1

7.5

±0.1

3.3

±0.1

1.75

±0.1

7.5

±0.1


Taping Drawings (UNIT:mm)

YT0630 mould smd inductor 10YT0630 mould smd inductor 11



(2) Reel Dimensions (Unit:mm)

YT0630 mould smd inductor 12YT0630 mould smd inductor 13YT0630 mould smd inductor 14


A

W

N

B

C

D

330+2.0

16.8+0.2

97+0.5

2.2+0.5

13.2±0.2

10.75±0.25


(3) Packaging Quantity (PCS)


Type

Standard Quantity

Reel

Inner box

Carton box

YT0630

1500 pcs / reel

3Reel / box (4500 pcs)

4 Middle boxes,

(18000 pcs)



(4) Peel force of top cover tape    

The peel speed shall be about 300mm/minute

The peel force of top cover tape shall be between 0.1 to 1.3 N

YT0630 mould smd inductor 15YT0630 mould smd inductor 16


(5) Reel Label

Label on the reel

• Customer's part Number

• Lot Number

• Quantity

        • date code

        Shipping Label

• Customer's part Number

• Manufacturer's part Number

        • Quantity

        • date code


(6) Inner Box

YT0630 mould smd inductor 17YT0630 mould smd inductor 18


(7) Carton

YT0630 mould smd inductor 19YT0630 mould smd inductor 20

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